Dielectric materials (SiO2, SiNx, etc.);
Silicon-based materials (Si, a-Si, poly-Si);
III-V materials (GaAs, InP, GaN, etc.);
Sputtered metals (Au, Pt, Ti, Ta, W, etc.);
Diamond-like carbon (DLC);
Metal Etching (Al, Ti, Ta, TiN, TaN);
Silicon (Trench & Deep Si Etch);
AlGaN, GaN, InP;
PLC Control System
Touch Screen Interface
Stainless Steel Chamber
Internal Gas Pod
Water Cooled Electrode
Vacuum Pump Options
The Mini-Lab MPS1400 series of R & D single wafer processing equipment, can be designed and manufactured to suit customer specific requirements. All system components are mounted within the system mainframe ensuring that the footprint is kept to a minimum. The modular design allows different RF sources, vacuum pumping packages and electrode configurations, to be easily incorporated into the system build.
For further information on the MPS1400 RIE/ICP system please call us on 0845 340 2626 or email our friendly team and someone will be in touch shortly.