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Products & Services

Mini Lab Plasma Pod System

Mini-Lab Plasma-Pod System – Plasma Etcher

Application:

Etching of the following materials:

  • Dielectric materials (SiO2, SiNx, etc.);

  • Silicon-based materials (Si, a-Si, poly-Si);

  • III-V materials (GaAs, InP, GaN, etc.);

  • Sputtered metals (Au, Pt, Ti, Ta, W, etc.);

  • Diamond-like carbon (DLC);

  • Failure Analysis.


Features:

  • Small system footprint Integral Gas Box and internal turbo pump Substrates up to 125mm in diameter Aluminium chamber with water-cooled substrate electrode Manual or automatic operation

Description:

The Plasma Pod System is designed especially for R&D processes on small components and substrates up to 125mm in diameter. The Plasma-Pod has an aluminum chamber with a water cooled substrate electrode accessible via the pneumatically operated top electrode. The system is equipped with a PLC control unit which interfaces with the operator touch screen. This control system allows manual or automatic operation, with process recipe storage and data logging.

Ethernet connection is also available for system monitoring. Systems can be configured to suit customer requirements and specific processes.


More Information:

For further information about the Plasma Pod System, please call 0845 340 2626 or email us and someone will be in touch soon.


 

Seeking Equipment for R&D and Semiconductor Production

Call 0845 340 2626 or contact us online for more information Should you require information to assist you in your Equipment Purchasing or Field Service Support, please call the number above and our friendly staff will be pleased to help.
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