Etching of the following materials:
Dielectric materials (SiO2, SiNx, etc.);
Silicon-based materials (Si, a-Si, poly-Si);
III-V materials (GaAs, InP, GaN, etc.);
Sputtered metals (Au, Pt, Ti, Ta, W, etc.);
Diamond-like carbon (DLC);
Small system footprint Integral Gas Box and internal turbo pump Substrates up to 125mm in diameter Aluminium chamber with water-cooled substrate electrode Manual or automatic operation
The Plasma Pod System is designed especially for R&D processes on small components and substrates up to 125mm in diameter. The Plasma-Pod has an aluminum chamber with a water cooled substrate electrode accessible via the pneumatically operated top electrode. The system is equipped with a PLC control unit which interfaces with the operator touch screen. This control system allows manual or automatic operation, with process recipe storage and data logging.
Ethernet connection is also available for system monitoring. Systems can be configured to suit customer requirements and specific processes.
For further information about the Plasma Pod System, please call 0845 340 2626 or email us and someone will be in touch soon.