Dielectric materials (SiO2, SiNx, etc.);
Silicon-based materials (Si, a-Si, poly-Si);
III-V materials (GaAs, InP, GaN, etc.);
Sputtered metals (Au, Pt, Ti, Ta, W, etc.);
Diamond-like carbon (DLC);
Small system footprint
Touch Screen Interface
Substrates up to 200mm in diameter
Stainless steel chamber
Integral Gas Box & Turbo pump
The Plasma Pod Plus System is designed specifically for R & D processes on substrates and components up to 200mm in diameter. The Plasma Pod Plus has a stainless steel chamber with a water cooled substrate electrode accessible via the pneumatically operated top electrode. The system is equipped with a PLC control unit which interfaces with the operator touch screen. This control system allows manual or automatic operation, with process recipe storage and data logging.
Ethernet connection is also available for system monitoring. Systems can be configured to suit customer requirements and specific processes.
To enquiry about this product, please call our friendly team on 0845 340 2626, or email us and someone will be in touch shortly.