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Products & Services

scia Trim 200


The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk acoustic wave (BAW) or surface acoustic wave (SAW) devices, localized pole trimming for thin film heads (TFH) and trimming of precision thin film resistors.

The scia Trim 200 is a high volume production system and accommodates a standard semiconductor cassette handling robot. Cluster tools with two process chambers and two cassette load-locks are available.

Seeking Equipment for R&D and Semiconductor Production

Call 0845 340 2626 or contact us online for more information Should you require information to assist you in your Equipment Purchasing or Field Service Support, please call the number above and our friendly staff will be pleased to help.
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