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Products & Services

scia Mill 150

The scia Mill 150 is designed for highly uniform Ion Beam Etching and Milling of single substrates up to 150 mm diameter. Carriers or wafers are loaded via an automatic handling system. The substrate holder has helium backside cooling and can be tilted and rotated. Typical applications are the structuring of metal films for MEMS and sensors.

The scia Mill 150 can be used for Ion Beam Etching (IBE) with inert gases. Additionally the system can be applied for Reactive Ion Beam Etching (RIBE) as well as for Chemically Assisted Ion Beam Etching (CAIBE).

The systems are especially appropriate for research and development and low volume production.

Seeking Equipment for R&D and Semiconductor Production

Call 0845 340 2626 or contact us online for more information Should you require information to assist you in your Equipment Purchasing or Field Service Support, please call the number above and our friendly staff will be pleased to help.
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