slide internal

Products & Services

Speedflo Reactive Gas Control

Equipment Names:

  • Speedflo
  • Speedflo Mini


Application:

  • High Speed adjustment of reactive gases during a plasma process.


Features/Benefits:

  • Prevents target poisoning in sputter process
  • Enhanced deposition/etch rates and improved uniformity
  • Upto 8 sensor input/outputs
  • Compatible with any sensor type


Description:

Speedflo is a mult-channel closed loop control system for high speed adjustment of gases during a plasma process (eg. Sputtering, PECVD or Plasma Etch). Its advanced digital control system automatically regulates gas flow to meet the plasma process requirements.

Speedflo’s control algorithms provide significant performance improvements over conventional PID control techniques in terms of both speed and robustness.


More Information:

If you would like further information on the Speedflo Reactive Gas Control product, please call us on 0845 340 2626. Alternatively, please email us and someone from our friendly team will contact you shortly.

 

Seeking Equipment for R&D and Semiconductor Production

Call 0845 340 2626 or contact us online for more information Should you require information to assist you in your Equipment Purchasing or Field Service Support, please call the number above and our friendly staff will be pleased to help.
© Omni Technologies 2019 | Terms | Privacy | Cookies | Site Info
Company No. 04221947 VAT No. 567608114